Chemical vapor precipitation technology

Chemical vapor deposition is a thermochemical reaction process that occurs on the surface of a specially treated substrate (including hard alloys and tool steel materials) at a specific temperature. CVD technology is often classified by reaction type or pressure, including low-pressure CVD (LPCVD), atmospheric pressure CVD (APCVD), plasma enhanced CVD (PECVD), as well as Hot Filament cVD and Laser Induced CVD.

Plasma assisted chemical vapor deposition is one of the main methods for preparing superhard thin films, which combines the advantages of physical vapor deposition and traditional chemical vapor deposition. It can deposit thin films at lower temperatures and can also be used for coating the inner surface of complex shaped workpieces. It is an effective way to improve the surface wear performance and high-temperature oxidation resistance of workpieces.

Physical gas-phase precipitation technology

Physical vapor deposition is the use of a certain vacuum physical process, such as evaporation or sputtering, to transfer substances, that is, atoms or molecules are transferred from the source to the substrate surface and deposited into a thin film.

It is an environmentally friendly surface treatment method that can truly obtain nanometer to micrometer level thin films without pollution, improving surface strength, enhancing corrosion resistance, friction and wear properties without affecting the substrate size.

The film layer prepared by physical vapor deposition (PVD) coating technology has the characteristics of high hardness, high wear resistance (low friction coefficient), good corrosion resistance, and chemical stability. At the same time, the film layer can also improve the decorative appearance of the workpiece. It can prepare various single metal films (such as aluminum, titanium, chromium, etc.), as well as nitride films TiN (titanium gold) ZrN (misalignment) Ceramic thin films such as CrN, TiA1N, carbide films (TiN, TiCN), and oxide films (TiO).

Cathodic arc technology

Cathodic arc technology utilizes arc discharge in a vacuum environment to evaporate and ionize the solid cathode target material, and through the strengthening effect of plasma, it flies towards the surface of the anode substrate to deposit a film. Cathodic arc is a typical high current (up to several hundred amperes) arc. Therefore, cathodic arc technology has a very high deposition rate, which can greatly improve the microstructure and mechanical properties of the film. Due to the intense process of cathodic arc evaporation, a large amount of harmful particles are generated during the process, which limits the application of cathodic arc technology in situations where high-quality surfaces are required.

Magnetron sputtering technology

Magnetron sputtering technology is a mature and widely used technique in the fields of functional and decorative coating. In the process of vacuum magnetron sputtering, the collision between ions and cathodes causes the target material to be sputtered out with particles with 4~6 eV, with an ionization rate of about 10%.